Engineering the electronic structure of surface dangling bond nanowires of different size and dimensionality
Citation:
Borislav Naydenov and John J. Boland, Engineering the electronic structure of surface dangling bond nanowires of different size and dimensionality, Nanotechnology, 24, 2013, 275202-Download Item:
Abstract:
We demonstrate how the local density of electronic states evolves as the size and dimensionality of surface dangling bond nanowires are modified. These wires were fabricated using the probe of a scanning tunneling microscope on a hydrogen passivated n-type Si(100)-(2 ? 1) surface. We demonstrate that by varying the number and arrangement of dangling bonds on the surface it is possible to arbitrarily engineer the electronic characteristic of a surface nanowire from that of a semiconductor with a controllable band gap to that of a metal.
Sponsor
Grant Number
Science Foundation Ireland (SFI)
06/IN.1/I106
Author's Homepage:
http://people.tcd.ie/naydenobDescription:
PUBLISHED
Author: NAYDENOV, BORISLAV
Type of material:
Journal ArticleCollections
Series/Report no:
Nanotechnology24
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Full text availableKeywords:
Condensed matter: electrical, magnetic and optical Surfaces, Interfaces and thin films, Nanoscale science and low-D systemsSubject (TCD):
Nanoscience & MaterialsDOI:
http://dx.doi.org/10.1088/0957-4484/24/27/275202Metadata
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